

Education & Government
Equideck® Flat Roofing
View DetailFast Facts
- Module Width1200
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Thickness R-Values50 1.4 75 2.1 100 2.7 125 3.3 150 4.0 200 5.2 250 6.5
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ColorbondYes
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BCA CompliantYes
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AvailabilityNationally, Produced Locally
Equitilt® Architectural Walling
View DetailFast Facts
- Module Width1200
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Thickness R-Values50 1.4 75 2.1 100 2.7 125 3;3 150 4.0 200 5.2 250 6.5
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FM ApprovedNo
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ColorbondYes
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BCA CompliantYes
-
AvailabilityNationally
Inspire® PIR Secret-Fix Wall Panel
View DetailFast Facts
- Module Width1100
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Thickness R-Values50 2.20 60 2.65 80 3.55 100 4.45
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FM ApprovedYes
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ColorbondYes
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BCA CompliantYes
-
AvailabilityNationally
MetecnoSpan® PIR Roofing
View DetailFast Facts
- Module Width1000
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Thickness R-Values40 1.85 60 2.75 80 3.65 100 4.55
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FM ApprovedYes
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BCA CompliantYes
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AvailabilityNational
SolarSpan® Insulated Roof Panel
View DetailFast Facts
- Module Width1000
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Thickness R-Values50 1.4 75 2.1 100 2.7 125 3.3 150 4.0 175 4.6^ 200 5.2
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ColorbondYes
-
BCA CompliantYes
-
AvailabilityNationally, Produced Locally
Application Summary
Bondor® offers a complete range of building material products that tick all the boxes for the modern educational facility seeking sustainable and inspirational structures. Bondor's range of products are energy efficient and hard wearing, which to allows designers to create schools, universities and other government structures that are sustainable, long lasting and creative. Select from Bondor's energy efficient building envelope range of insulated walling and roofing products to produce environmentally sustainable buildings. The Bondor® range of architectural walling products; Ceratec®, Fundermax®, Equitilt®, Larson® and Larcore®; offers design versatility, thermal efficiency and efficient installation. For a complete roofing, insulation and ceiling solution, SolarSpan® is the three-in-on panel, ideal for finishing long lasting and thermally efficient buildings. If fire performance is required for insurance purposes, Factory Mutual Approved roofing panels MetecnoSpan® is specified.